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Cross-sectional shape of groove processing using ultrashort pulse laser.

Using a picosecond laser with the same spot diameter for SUS and PI, we processed five types of grooves with different depths.

The five grooves in the image are all processed with a target width of 15μm. Even if the entrance width is the same, you can see that the cross-section changes from a U-shape for shallow grooves to a V-shape for deep grooves. Similarly, when the material changes from metal to resin, the change in cross-sectional shape can also be observed.

  • Processing Contract
  • Laser microgroove processing

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